Patent · US Active

Bare-die smart bridge connected with copper pillars for system-in-package apparatus

US12341096B2 · kind B2 · utility

0Cited by

5References

10Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Georg Seidemann · Landshut, DE
Thomas Wagner · Regelsbach, DE
Andreas Wolter · Regensburg, DE
Bernd Waidhas · Nittendorf, DE

Key dates

Filing date	Apr 8, 2022
Grant date	Jun 24, 2025
Priority date	—
Expiry date	Apr 8, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A system-in-package apparatus includes a semiconductive bridge that uses bare-die pillars to couple with a semiconductive device such as a processor die. The apparatus achieves a thin form factor.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.