Shielded semiconductor package with open terminal and methods of making
US12341108B2 · kind B2 · utility
0Cited by
25References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2023 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Oct 12, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a substrate. An electrical component is disposed over a surface of the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the surface of the substrate remains exposed from the encapsulant. A shielding layer is formed over the encapsulant. A portion of the shielding layer is removed to expose the portion of the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.