Laser processing apparatus
US12343812B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2023 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Mar 21, 2044 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/56
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser oscillation mechanism of a laser beam irradiation unit has a first mode to break growing debris, a second mode to suppress generation of molten debris, and a third mode to break the growing debris and suppress generation of the molten debris. The laser oscillation mechanism includes a selecting part that selects any of the first mode, the second mode, and the third mode. The laser oscillation mechanism sets a repetition frequency with a first group being one unit in the first mode, and sets a repetition frequency with a second group being one unit in the second mode, and sets a repetition frequency with a third group being one unit in the third mode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.