Methods for fabrication of optical structures on photonic glass layer substrates
US12345934B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2022 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Feb 12, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12173
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Embodiments described herein also relate to electronic and photonic integrated circuits and methods for fabricating integrated interconnect between electrical, opto-electrical and photonic devices. One or more optical silicon photonic devices described herein may be used in connection with one or more opto-electrical integrated circuits (opto-electrical chip) on a single package substrate to from a co-packaged optical and electrical device. The methods described herein enable high volume manufacturing of electrical, opto-electrical and the optical silicon photonic devices having a plurality of optical structures, such as waveguides, formed on or integral with a photonic glass layer substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.