Anup Pancholi
21Patents
2h-index
19Co-inventors
46Inventor score
Filing activity: Mar 30, 2017 → Aug 29, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10361337B2 | Micro light-emitting diode (LED) display and fluidic self-assembly of same | Electricity | 5 | Active |
| US10439101B2 | Micro light-emitting diode (LED) elements and display | Electricity | 3 | Active |
| US11037817B2 | Apparatus with multi-wafer based device and method for forming such | Electricity | 2 | Active |
| US11251158B2 | Monolithic chip stacking using a die with double-sided interconnect layers | Electricity | 2 | Active |
| US11037916B2 | Apparatus with multi-wafer based device comprising embedded active devices and method for forming such | Electricity | 0 | Active |
| US11908687B2 | III-N multichip modules and methods of fabrication | Electricity | 0 | Active |
| US11637093B2 | Micro light-emitting diode display fabrication and assembly | Electricity | 0 | Active |
| US11659722B2 | Thin-film-transistor based complementary metal-oxide-semiconductor (CMOS) circuit | Electricity | 0 | Active |
| US12345934B2 | Methods for fabrication of optical structures on photonic glass layer substrates | Physics | 0 | Active |
| US11908981B2 | Laser printing of color converter devices on micro led display devices and methods | Electricity | 0 | Active |
| US11527683B2 | Laser printing of color converter devices on micro LED display devices and methods | Electricity | 0 | Active |
| US12362325B2 | Monolithic chip stacking using a die with double-sided interconnect layers | Electricity | 0 | Active |
| US11948831B2 | Apparatus with multi-wafer based device and method for forming such | Electricity | 0 | Active |
| US11610936B2 | Micro light-emitting diode displays having color conversion devices and assembly approaches | Electricity | 0 | Active |
| US11784165B2 | Monolithic chip stacking using a die with double-sided interconnect layers | Electricity | 0 | Active |
| US11211245B2 | III-N multichip modules and methods of fabrication | Electricity | 0 | Active |
| US10923622B2 | Micro light-emitting diode (LED) elements and display | Electricity | 0 | Active |
| US11245053B2 | Micro-LED structures for full color displays and methods of manufacturing the same | Electricity | 0 | Active |
| US12389728B2 | Micro-LED displays including solder structures and methods | Electricity | 0 | Active |
| US11177243B2 | Micro light-emitting diode display fabrication and assembly | Electricity | 0 | Active |
| US10714446B2 | Apparatus with multi-wafer based device comprising embedded active and/or passive devices and method for forming such | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.