Substrate processing method and substrate processing apparatus
US12362202B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2023 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Nov 27, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing method includes: increasing a temperature of a substrate by heating the substrate; after the increasing the temperature of the substrate, forming a liquid film of a pre-wetting liquid on a first surface of the substrate by supplying the pre-wetting liquid to the first surface of the substrate while heating and rotating the substrate at a first rotational speed; after the forming the liquid film, processing the first surface of the substrate with a chemical liquid by supplying the chemical liquid to the first surface of the substrate while heating and rotating the substrate at a second rotational speed that is lower than the second rotational speed; and after the processing the first surface of the substrate, decreasing the temperature of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.