Package structure and method of forming the same
US12362274B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Feb 20, 2024 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Feb 20, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package structure includes a thermal dissipation structure including a substrate, a first encapsulant laterally covering the substrate, a die disposed on the substrate and including a sensing region, a second encapsulant laterally covering the die, and a redistribution structure disposed on the die and the second encapsulant. An outer sidewall of the second encapsulant is laterally offset from an outer sidewall of the first encapsulant. The die is electrically coupled to the substrate through the redistribution structure, and the redistribution structure includes a hollow region overlying the sensing region of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.