Method of making a fan-out semiconductor assembly with an intermediate carrier
US12362322B2 · kind B2 · utility
0Cited by
19References
21Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 19, 2024 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Jun 19, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a semiconductor assembly may include providing a plurality of components, providing a one or more intermediate carriers, and mounting the plurality of components to the one or more intermediate carriers. The method may further include providing a temporary carrier, mounting the one or more intermediate carriers to the temporary carrier, and disposing an encapsulant over the one or more intermediate carriers and over the plurality of components mounted to the temporary carrier to form a reconstituted panel. The encapsulant may be disposed around four side surfaces of each of the plurality of components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.