Methods and apparatus for controlling a lithographic process
US12366809B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2019 |
| Grant date | Jul 22, 2025 |
| Priority date | — |
| Expiry date | Jul 18, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B13/0265
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of determining a control parameter for a lithographic process is disclosed, the method includes: defining a substrate model for representing a process parameter fingerprint across a substrate, the substrate model being defined as a combination of basis functions including at least one basis function suitable for representing variation of the process parameter fingerprint between substrates and/or batches of substrates; receiving measurements of the process parameter across at least one substrate; calculating substrate model parameters using the measurements and the basis functions; and determining the control parameter based on the substrate model parameters and the similarity of the at least one basis function to a process parameter fingerprint variation between substrates and/or batches of substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.