Metrology system and method for determining a characteristic of one or more structures on a substrate
US12366811B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
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Key dates
| Filing date | Apr 30, 2024 |
| Grant date | Jul 22, 2025 |
| Priority date | — |
| Expiry date | Apr 30, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B2210/56
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Described is a metrology system for determining a characteristic of interest relating to at least one structure on a substrate, and associated method. The metrology system comprises a processor being configured to computationally determine phase and amplitude information from a detected characteristic of scattered radiation having been reflected or scattered by the at least one structure as a result of illumination of said at least one structure with illumination radiation in a measurement acquisition, and use the determined phase and amplitude to determine the characteristic of interest.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.