Embedded cooling systems for advanced device packaging and methods of manufacturing the same
US12368087B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2024 |
| Grant date | Jul 22, 2025 |
| Priority date | — |
| Expiry date | Aug 1, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B80/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device package comprising an integrated cooling assembly comprising a semiconductor device and a cold plate directly bonded to the semiconductor device. The cold plate comprises a top portion, sidewalls extending downwardly from the top portion to a backside of the semiconductor device, an inlet opening, and an outlet opening. The top portion, the sidewalls, and the backside of the semiconductor device collectively define a coolant chamber volume therebetween. The inlet opening and the outlet opening are disposed in the top portion and are in fluid communication with the coolant chamber volume. The inlet opening is disposed above a hotspot region of the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.