Polishing apparatus using machine learning and compensation for pad thickness
US12370646B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2022 |
| Grant date | Jul 29, 2025 |
| Priority date | — |
| Expiry date | Apr 24, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06N3/045
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Data received from an in-situ monitoring system includes, for each scan of a sensor, a plurality of measured signal values for a plurality of different locations on a layer. A thickness of a polishing pad is determined based on the data from the in-situ monitoring system. For each scan, a portion of the measured signal values are adjusted based on the thickness of the polishing pad. For each scan of the plurality of scans and each location of the plurality of different locations, a value is generated representing a thickness of the layer at the location. This includes processing the adjusted signal values using one or more processors configured by machine learning. A polishing endpoint is detected or a polishing parameter is modified based on the values representing the thicknesses at the plurality of different locations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.