Substrate processing apparatus, substrate processing method, and chemical liquid
US12371796B2 · kind B2 · utility
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2References
11Claims
0Family size
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Key dates
| Filing date | Oct 26, 2022 |
| Grant date | Jul 29, 2025 |
| Priority date | — |
| Expiry date | Nov 17, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6708
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing method includes: supplying a first processing liquid containing a chelating agent and a solvent from a first tank toward a substrate having a film of a metal formed on a surface thereof to generate a complex containing the metal and the chelating agent while rotating the substrate; and supplying a second processing liquid containing water toward the substrate to dissolve the complex in the second processing liquid while rotating the substrate, after the complex is generated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.