Edge termination structures for semiconductor devices

US12376332B2 · kind B2 · utility

Assignee

• Wolfspeed, Inc. · US

Inventors

• Edward Robert Van Brunt · Raleigh, US
• Thomas E. Harrington, III · Los Altos, US

Key dates

• Filing date: Feb 2, 2023
• Grant date: Jul 29, 2025
• Expiry date: Jun 28, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D64/112

Abstract

Semiconductor devices, and more particularly semiconductor devices with improved edge termination structures are disclosed. A semiconductor device includes a drift region that forms part of an active region. An edge termination region is arranged along a perimeter of the active region and also includes a portion of the drift region. The edge termination region includes one or more sub-regions of an opposite doping type than the drift region and one or more electrodes may be capacitively coupled to the drift region by way of the one or more sub-regions. During a forward blocking mode for the semiconductor device, the one or more electrodes may provide a path that draws ions away from passivation layers that are on the edge termination region and away from the active region. In this manner, the semiconductor device may exhibit reduced leakage, particularly at higher operating voltages and higher associated operating temperatures.