Substrate processing apparatus and control method of substrate processing apparatus
US12377384B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2022 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Nov 16, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67155
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A substrate processing apparatus includes processing units, an exhaust path, a gas processing apparatus and a controller. Each processing unit is configured to process a substrate by using a chemical. A gas exhausted from the processing units flows through the exhaust path. The gas processing apparatus is provided in the exhaust path to remove a target component contained in the gas. The gas processing apparatus includes a duct, a partition plate and a liquid supply. The duct has therein a flow path. The partition plate divides the flow path into spaces, and is formed of a porous material, through which the gas passes, configured to retain a liquid. The liquid supply is configured to supply a dissolving liquid configured to dissolve the target component to the partition plate. The controller adjusts a flow rate of the dissolving liquid according to operation information indicating an operational status of the processing units.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.