High temperature coatings for a preclean and etch apparatus and related methods
US12378665B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2018 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Jan 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/3341
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A coating and a method to form the coating is proposed for a semiconductor film pre-clean and etch apparatus. The coating may be employed in environments where it is difficult to use a traditional coating or coating method. The coatings provide advantages including: an ability to effectively deliver hydrogen radicals and fluorine radicals to a wafer surface in one apparatus or individually in two apparatuses; a coverage of high aspect ratio features on critical components; an operability in high temperatures exceeding 150° C.; and a protection of a part with high aspect ratio features underneath the coating, thereby preventing metal and particles on a processed wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.