Methods for filling a gap and related systems and devices
US12381087B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2022 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Nov 16, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/666
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and related systems for filling a gap feature comprised in a substrate are disclosed. The methods comprise a step of providing a substrate comprising one or more gap features into a reaction chamber. The one or more gap features comprise a proximal part comprising a proximal surface and a distal part comprising a distal surface. The methods further comprise a step of subjecting the substrate to a plasma treatment. Thus the proximal surface is inhibited while leaving the distal surface substantially unaffected. Then, the methods comprise a step of selectively depositing a metal- and nitrogen-containing material on the distal surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.