Substrate treating apparatus
US12381097B2 · kind B2 · utility
0Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2021 |
| Grant date | Aug 5, 2025 |
| Priority date | — |
| Expiry date | Dec 10, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B5/3066
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure provides a substrate treating apparatus. The substrate treating apparatus includes a support unit that supports a substrate, and a laser unit that irradiates a laser beam to the substrate supported by the support unit, the laser unit includes an irradiation member that irradiates the laser beam, a lens disposed on a travel path of the laser beam irradiated by the irradiation member to be rotatable, and a reflection member having an inclined surface for changing the travel path of the laser beam that passed through the lens.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.