Micropillar-enabled thermal ground plane
US12385697B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2023 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Aug 24, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3736
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.