Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component
US12386256B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2019 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Apr 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/027
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition comprises a polyimide precursor having a polymerizable unsaturated bond; one or more compounds represented by any of the following formulas (1) to (4); and photopolymerization initiator represented by the following formula (11). In formulas (1) to (4), R1, R2, and R8 are independently an alkyl group including 1 to 4 carbon atoms, and R3 to R7 are independently a hydrogen atom, or an alkyl group including 1 to 4 carbon atoms; and in the formula (11), R11 is an alkyl or alkoxy group including 1 to 12 carbon atoms, a cycloalkyl group including 4 to 10 carbon atoms, a phenyl group, or a tolyl group; R12 is an alkyl group including 1 to 12 carbon atoms, a cycloalkyl group including 4 to 10 carbon atoms, a phenyl group, or a tolyl group; and R13 is a benzoyl group, a fluorenyl group, or a carbazolyl group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.