Photosensitive resin composition, method of manufacturing pattern cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component
US12386257B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Aug 12, 2020 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Apr 28, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition of the invention contains (A) a polyimide precursor having a polymerizable unsaturated bond, (B) a photopolymerization initiator comprising a compound represented by the formula (11), (C) a thermal radical generator, and (D) a solvent containing γ-butyrolactone:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.