Holistic analysis of multidimensional sensor data for substrate processing equipment
US12386342B2 · kind B2 · utility
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6References
20Claims
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Key dates
| Filing date | May 11, 2022 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | May 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method includes receiving, by a processing device, first data. The first data includes data from one or more sensors of a processing chamber and is associated with a processing operation. The first data is resolved in at least two dimensions, one of which is time. The method further includes providing the first data to a model. The method further includes receiving from the model second data. The second data includes an indication of an evolution of a processing parameter during the processing operation. The method further includes causing performance of a corrective action in view of the second data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.