Film forming apparatus, processing condition determination method, and film forming method
US12387922B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2022 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Sep 25, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/332
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A film forming apparatus for forming a film by magnetron sputtering includes a substrate support supporting the substrate, a holder holding a target for emitting sputtered particles, a magnet unit having a magnet, first and second movement mechanisms configured to periodically move the substrate support and the magnet unit, respectively, and a controller. The controller is configured to control the first movement mechanism and the second movement mechanism so that a phase in a periodic movement of the substrate support remains the same at a start of film formation and at an end of film formation, a phase in a periodic movement of the magnet unit remains the same at a start of film formation and at an end of film formation, and the phase in the periodic movement of the substrate support and the phase in the periodic movement of the magnet unit do not match during film formation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.