Lithographically defined electrical interconnects from conductive pastes
US12388004B2 · kind B2 · utility
0Cited by
3References
11Claims
0Family size
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Key dates
| Filing date | Sep 9, 2020 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Apr 12, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/092
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to electrical interconnect structures formed from a lithographically defined polymer coating in conjunction with a conductive paste, and methods for forming same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.