Bonding system and bonding method
US12388045B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 14, 2023 |
| Grant date | Aug 12, 2025 |
| Priority date | — |
| Expiry date | Oct 14, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/83894
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Bonding system for bonding a second article to a first article, comprising an activation treatment device that comprises an object supporter that supports objects comprising the second article, and a particle beam source that activates a bonding surface of the second article by irradiating the objects with a particle beam, the objects being set on one treatment surface without being opposed to each other, followed by performing activation treatment by the particle beam source; and a bond device that brings the second article, of which the bonding surface is activated by the activation treatment device, into contact with the first article, to thereby bond the second article to the first article, wherein the object supporter supports the objects in a posture in which a portion formed of a plurality of kinds of materials comprising the bonding surface of the second article in the objects is exposed to the particle beam source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.