Subsurface alignment metrology system for packaging applications
US12394655B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2022 |
| Grant date | Aug 19, 2025 |
| Priority date | — |
| Expiry date | Jul 22, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/8013
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for detecting metrology data in semiconductor packaging processes using fast focus and acquisition techniques to determine alignment metrology data for hybrid bonding. In some embodiments, the apparatus may include a source configured to illuminate a focal point with a wavelength selected from wavelengths greater than 1100 nm, an optical lens that forms an illumination beam when illuminated by the source, an acousto-optic scanner that moves the illumination beam back and forth in a scanning pattern, a splitter to allow the illumination beam to be directed at a metrology sampling location while allowing a reflection beam caused by the illumination beam to pass through the splitter to a detector, a set of optics configured to focus the illumination beam at one or more focal points in a Z direction to obtain subsurface images, and a substrate platform configured to hold a substrate and to move the substrate during scanning.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.