Substrate location detection and adjustment
US12397435B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2020 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Oct 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68721
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods are provided for positioning a wafer in relation to a datum structure. In one example, a system comprises a camera arrangement including at least two cameras, each of the at least two cameras including a field of view when positioned in the camera arrangement, each field of view including a peripheral edge of the wafer and a peripheral edge of the datum structure. A processor receives positional data from each of the at least two cameras and determines, in relation to each field of view, a gap size between the respective peripheral edges of the wafer and the datum location included in the respective field of view. A controller adjusts a position of the wafer relative to the datum structure based on the determined respective gap sizes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.