Composition and method for polishing boron doped polysilicon
US12398293B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2022 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Mar 11, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a method of chemically mechanically polishing a substrate, especially a substrate comprising boron-doped polysilicon, comprising contacting the substrate with a chemical-mechanical polishing composition comprising an abrasive selected from α-alumina, silica, and a combination thereof, ferric ion, an organic acid, or a combination thereof, and water. The invention also provides a chemical-mechanical polishing composition comprising α-alumina, a nitrogen-containing compound selected from a zwitterionic homopolymer at, a monomeric ammonium salt, and a combination thereof, an organic acid, and water. The invention further provides a chemical-mechanical polishing composition comprising silica, an organic acid, ferric ion, and water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.