Patent · US Active

Component with dielectric layer for embedding in component carrier

US12400968B2 · kind B2 · utility

0Cited by

3References

16Claims

0Family size

Assignee

AT&S Austria Technologie & Systemtechnik Aktiengesellschaft · AT

Inventors

Gerald Weidinger · Leoben, AT
Andreas Zluc · Leoben, AT

Key dates

Filing date	Jul 24, 2023
Grant date	Aug 26, 2025
Priority date	—
Expiry date	Jul 24, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/96
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and a component having one or more pads and at least one dielectric layer on at least one main surface of the component. The at least one dielectric layer does not extend beyond the main surface in a lateral direction. The dielectric layer at least partially covers one or more pads of the component. In addition, at least one electrically conductive contact extends through at least one opening in the dielectric layer up to at least one of the pads.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.