Interconnect structure and electronic device including the same
US12400975B2 · kind B2 · utility
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2References
22Claims
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Key dates
| Filing date | Dec 13, 2021 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Jan 7, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/53276
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are an interconnect structure and an electronic device including the same. The interconnect structure may include a conductive wiring having a certain pattern, a dielectric layer on side surfaces of the conductive wiring, a capping layer on the conductive wiring, and a graphene layer on the dielectric layer. The graphene layer may include a graphene material. A ratio of carbons having sp3 bonds to carbons having sp2 bonds in the graphene material is 1 or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.