Junghoo Shin
6Patents
1h-index
15Co-inventors
37Inventor score
Filing activity: Jan 14, 2020 → Mar 21, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11069613B2 | Integrated circuit device and method of manufacturing the same | Electricity | 1 | Active |
| US12400975B2 | Interconnect structure and electronic device including the same | Electricity | 0 | Active |
| US12080595B2 | Method of forming interconnect structure | Electricity | 0 | Active |
| US12315792B2 | Semiconductor device | Electricity | 0 | Active |
| US12125785B2 | Semiconductor integrated circuit device suppressing leakage current of multilayer wiring structures | Electricity | 0 | Active |
| US11721622B2 | Semiconductor devices | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.