Electronic device including two-dimensional material and method of manufacturing the same
US12402374B2 · kind B2 · utility
0Cited by
24References
18Claims
0Family size
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Key dates
| Filing date | Feb 16, 2022 |
| Grant date | Aug 26, 2025 |
| Priority date | — |
| Expiry date | Sep 8, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/883
Abstract
An electronic device including a two-dimensional material is provided. The electronic device may include a substrate; a metal layer on a partial region of the substrate; a two-dimensional material layer over the metal layer and an upper surface of the substrate; and an insertion layer between the metal layer and the two-dimensional material layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.