Eddy current monitoring to detect vibration in polishing
US12403561B2 · kind B2 · utility
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3References
5Claims
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Key dates
| Filing date | Mar 9, 2022 |
| Grant date | Sep 2, 2025 |
| Priority date | — |
| Expiry date | Jun 26, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A body is brought into contact with a polishing pad of a polishing system, a polishing liquid is supplied to the polishing pad, relative motion between the body and the polishing pad is generated while the body contacts the polishing pad, a signal from an in-situ eddy current monitoring system during the relative motion while the body contacts the polishing pad, generating, and mechanical vibrations in the polishing system are detected based on a signal from the in-situ eddy current monitoring system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.