Method for producing a bonding pad for a micromechanical sensor element

US12404170B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Andreas Prinzen · Reutlingen, DE
• Christof Schwenk · Glatten, DE
• Frank Reichenbach · Wannweil, DE
• Friedjof Heuck · Stuttgart, DE
• Heiko Stahl · Reutlingen, DE
• Nicolas Schorr · Reutlingen, DE

Key dates

• Filing date: Jan 9, 2023
• Grant date: Sep 2, 2025
• Expiry date: Feb 15, 2044

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0109
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method for producing a bonding pad for a micromechanical sensor element. The method includes: depositing a first metal layer onto a top face of the functional layer, and depositing a second metal layer onto the first metal layer, wherein only the first layer or only the second layer is formed in a border region extending around a bonding pad region; covering a protective layer over a top face of the second metal layer in the bonding pad region and over the first or second metal layer in an inner peripheral portion of the border region, which inner peripheral portion adjoins the bonding pad region; etching the first or second layer at least in an outer peripheral portion of the border region down to the top face of the functional layer; removing the protective layer; carrying out an etching process starting from the top face of the layered structure.