Nicolas Schorr
3Patents
1h-index
9Co-inventors
33Inventor score
Filing activity: Jul 30, 2018 → Jan 9, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11130672B2 | Micromechanical device and corresponding production method | Performing Operations; Transporting | 1 | Active |
| US12094717B2 | Method for forming a trench in a first semiconductor layer of a multi-layer system | Performing Operations; Transporting | 0 | Active |
| US12404170B2 | Method for producing a bonding pad for a micromechanical sensor element | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.