Sharing memory and I/O services between nodes
US12405904B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2024 |
| Grant date | Sep 2, 2025 |
| Priority date | — |
| Expiry date | Jan 22, 2044 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A first die has a port to couple the first die to a second die over a die-to-die interconnect. The port includes circuitry to implement a physical layer of the die-to-die interconnect, send first protocol identification data over the physical layer to identify a first protocol in a plurality of protocols, send first data over the interconnect to the second die, wherein the first data comprise data of the first protocol, send second protocol identification data over the physical layer to identify a different second protocol in the plurality of protocols, and send second data over the interconnect to the second die, wherein the second data comprise flits of the second protocol.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.