Wafer separation apparatus and method, and method for manufacturing silicon wafer
US12406863B2 · kind B2 · utility
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Key dates
| Filing date | Dec 20, 2023 |
| Grant date | Sep 2, 2025 |
| Priority date | — |
| Expiry date | Apr 14, 2044 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
It would be helpful to provide a wafer separation apparatus and method, and a method for manufacturing a silicon wafer in which poor wafer separation can be easily prevented. A wafer separation apparatus 1 includes an injection port 2 configured to inject a fluid, a rolling element 3, and a holder 4 configured to movably hold the rolling element 3 in a rollable and integral manner, to be reciprocatable and biased to one side in a reciprocating direction, and to be integrally connected to the injection port 2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.