Patent · US Active

Electrostatic chucks with hybrid pucks to improve thermal performance and leakage current stability

US12412769B2 · kind B2 · utility

0Cited by

2References

20Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Yogananda SARODE · Kanchinakote, IN
Anand KUMAR · Bengaluru, IN
Prashant V. Javali · Kanchinakote, IN

Key dates

Filing date	May 16, 2023
Grant date	Sep 9, 2025
Priority date	—
Expiry date	Dec 11, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/68785
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device includes a hybrid puck corresponding to an electrostatic chuck. The hybrid puck includes a backing region and a chucking region disposed on the backing region. The backing region includes a first dielectric material to improve thermal performance of the hybrid puck. The chucking region includes a second dielectric material different from the first dielectric material to improve leakage current stability.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.