Support frame structure and manufacturing method thereof
US12412843B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2023 |
| Grant date | Sep 9, 2025 |
| Priority date | — |
| Expiry date | Jan 25, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/18
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are a method for manufacturing a support frame structure and a support frame structure. The support frame structure is used for embedded packaging, and includes: a metal plate comprising a support region and an opening region, at least one upper dielectric hole and at least one lower dielectric hole being formed respectively in upper and lower surfaces of the support region, the upper dielectric hole being communicated with the lower dielectric hole; at least one set of metal pillars comprising an upper metal pillar and a lower metal pillar, the upper metal pillar and the lower metal pillar being vertically connected to upper and lower surfaces of the metal plate, respectively; a dielectric layer comprising an upper dielectric layer and a lower dielectric layer, the upper dielectric layer and the lower dielectric layer being correspondingly formed on the upper surface of the metal plate and the upper dielectric hole and on a lower surface of the metal plate and the lower dielectric hole, respectively; and at least one core embedding cavity arranged in the opening region, running through the dielectric layer and the metal plate, and spaced from the upper dielectric hole an…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.