Wafer far edge temperature measurement system with lamp bank alignment
US12417933B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2022 |
| Grant date | Sep 16, 2025 |
| Priority date | — |
| Expiry date | Apr 28, 2044 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/0806
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A reactor system designed to provide accurate monitoring of wafer temperatures during deposition steps. The reactor system includes a pyrometer mounting assembly supporting and positioning three or more pyrometers (e.g., infrared (IR) pyrometers) relative to the reaction chamber to measure a center wafer temperature and an edge wafer temperature as well as reaction chamber temperature. The pyrometer mounting assembly provides a small spot size or temperature sensing area with the edge pyrometer to accurately measure edge wafer temperatures. A jig assembly, and installation method for each tool setup, is provided for use in achieving accurate alignment of the IR pyrometer sensing spot (and the edge pyrometer) relative to the wafer, when the pyrometer mounting assembly is mounted upon a lamp bank in the reactor system or in tool setup. The wafer edge temperature sensing with the reactor system assembled with proper alignment ensures accurate and repeatable measurement of wafer temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.