Inductor-integrating embedded support frame and substrate, and manufacturing method thereof
US12418988B2 · kind B2 · utility
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Key dates
| Filing date | Mar 1, 2022 |
| Grant date | Sep 16, 2025 |
| Priority date | — |
| Expiry date | May 6, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2017/048
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An inductor-integrating embedded support frame according to an embodiment of the present disclosure includes a core dielectric layer, a through-opening penetrating through the core dielectric layer, wherein the through-opening is used for embedding and installing a device, and an inductor, wherein the inductor includes a magnetic core embedded in the core dielectric layer and an inductance coil wound around the magnetic core, wherein at least one conductive copper pillar penetrating through the core dielectric layer is provided at the periphery of the through-opening and the inductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.