Method and apparatus for processing surface of a semiconductor substrate
US12421596B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2020 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | May 27, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67161
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for processing a surface of a substrate with a cluster apparatus including a transport chamber and two or more process reactors connected to the transport chamber. The method further includes subjecting the surface of the substrate to a surface preparation step for providing a prepared substrate surface, providing an interface layer on the prepared substrate surface of the substrate for forming an interfaced substrate surface, and providing a functional layer on the interfaced substrate surface of the substrate. The process steps are carried out in at least two different process reactors connected to transport chamber the substrate is transported between the at least two process reactors via the transport chamber under vacuum atmosphere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.