Nested glass packaging architecture for hybrid electrical and optical communication devices

US12422615B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Srinivas V. Pietambaram · Gilbert, US
• Brandon C. Marin · Chandler, US
• Debendra Mallik · Chandler, US
• Tarek A. Ibrahim · Mesa, US
• Jeremy Ecton · Gilbert, US
• Omkar G. Karhade · Chandler, US
• Bharat P. Penmecha · Chandler, US
• Xiaoqian Li · Chandler, US
• Nitin A. Deshpande · Chandler, US
• Mitul Modi · Phoenix, US
• Bai Nie · Chandler, US

Key dates

• Filing date: Sep 13, 2021
• Grant date: Sep 23, 2025
• Expiry date: Jan 3, 2044

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/857
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An optoelectronic assembly is disclosed, comprising a substrate having a core comprised of glass, and a photonic integrated circuit (PIC) and an electronic IC (EIC) coupled to a first side of the substrate. The core comprises a waveguide with a first endpoint proximate to the first side and a second endpoint exposed on a second side of the substrate orthogonal to the first side. The first endpoint of the waveguide is on a third side of the core parallel to the first side of the substrate. The substrate further comprises an optical via aligned with the first endpoint, and the optical via extends between the first side and the third side. In various embodiments, the waveguide is of any shape that can be inscribed by a laser between the first endpoint and the second endpoint.