Semiconductor processing system with a manifold for equal splitting and common divert architecture
US12424414B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2021 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Jun 30, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/33
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Exemplary substrate processing systems may include a lid plate. The systems may include a gas splitter seated on the lid plate. The gas splitter may include a top surface and side surfaces. The gas splitter may define a first and second gas inlets, with each gas inlet extending through one side surface. The gas splitter may define first and second gas outlets extending through the top surface. The gas splitter may define first and second gas lumens that extend between and fluidly couple each gas inlet with corresponding gas outlets. The gas splitter may define mixing channels that include a mixing outlet extending through a side surface and a mixing inlet extending through the top surface. The systems may include output manifolds seated on the lid plate. The systems may include output weldments that fluidly couple each mixing outlet with a respective one of the output manifolds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.