CMP system and method of use
US12424449B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Apr 10, 2024 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Apr 10, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/822
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.