Chip separation supported by back side trench and adhesive therein

US12424495B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Gunther Mackh · Dresden, DE
• Martin Brandl · Kelheim, DE

Key dates

• Filing date: Mar 23, 2022
• Grant date: Sep 23, 2025
• Expiry date: Dec 16, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2221/68381
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of separating an electronic chip from a wafer is disclosed. In one aspect, the method comprises forming at least one trench in a back side of the wafer around at least part of the electronic chip to be separated, forming a back side metallization covering at least part of the back side and at least part of the at least one trench and attaching an adhesive layer of a tape to at least part of the back side metallization. The electronic chip is separated by removing material from a front side of the wafer along a separation path which includes part of the at least one trench in such a way that, during separating, the adhesive layer fills at least part of the at least one trench above a level of the back side metallization on the back side.