Manufacturing method of semiconductor structure and semiconductor structure thereof
US12424499B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2022 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Nov 4, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/06515
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor structure is provided. The semiconductor structure includes an interconnection structure, a first conductive pad, a second conductive pad, a conductive material and a conductive coil. The first and second conductive pads are disposed over and electrically connected to the interconnection structure individually. The conductive material is electrically isolated from the interconnection structure, wherein bottom surfaces of the conductive material, the first conductive pad and the second conductive pad are substantially aligned. The conductive coil is disposed in the interconnection structure and overlapped by the conductive material. A manufacturing method of a semiconductor structure is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.