Multi-chip or multi-chiplet fan-out device for laminate and leadframe packages
US12424527B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2024 |
| Grant date | Sep 23, 2025 |
| Priority date | — |
| Expiry date | Jun 13, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic assembly component may comprise at least one fan-out device comprising a first encapsulant disposed around a memory device or function and a processor device or function, and a fan-out interconnect structure disposed over the first encapsulant and the at least one fan-out device. Input output pads may be disposed over the fan-out interconnect structure. A structural support may comprise electrical routing and structural support pads, the structural support further comprising at least one mounting site to which the at least one fan-out device is coupled. An electrical connector may be configured to electrically couple the input output pads of the at least one fan-out device to the structural support pads. A second encapsulant may be disposed over at least a portion of the at least one fan-out device and the structural support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.