Semiconductor package
US12431474B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2022 |
| Grant date | Sep 30, 2025 |
| Priority date | — |
| Expiry date | Jan 6, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/1058
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a semiconductor package, including a first redistribution substrate, a first semiconductor chip on the first redistribution substrate, first bumps between the first redistribution substrate and the first semiconductor chip, a conductive structure on the first redistribution substrate and spaced apart from the first semiconductor chip, a second redistribution substrate on the first semiconductor chip, second bumps between the first semiconductor chip and the second redistribution substrate, a second semiconductor chip on the second redistribution substrate, a first mold layer between the first redistribution substrate and the second redistribution substrate, and on the first semiconductor chip, and a second mold layer on the second redistribution substrate and the second semiconductor chip, and spaced apart from the first mold layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.