Yonghoe Cho
12Patents
2h-index
16Co-inventors
43Inventor score
Filing activity: Jun 3, 2018 → Jan 9, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10748953B2 | Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the same | Electricity | 2 | Active |
| US11862596B2 | Semiconductor package | Electricity | 2 | Active |
| US11552037B2 | Semiconductor package | Electricity | 1 | Active |
| US11869818B2 | Chip-stacked semiconductor package and method of manufacturing same | Electricity | 0 | Active |
| US11328966B2 | Chip-stacked semiconductor package and method of manufacturing same | Electricity | 0 | Active |
| US11335719B2 | Semiconductor package including an image sensor chip and a method of fabricating the same | Electricity | 0 | Active |
| US12431474B2 | Semiconductor package | Electricity | 0 | Active |
| US11244894B2 | Semiconductor packages | Electricity | 0 | Active |
| US11776941B2 | Semiconductor package | Electricity | 0 | Active |
| US11824076B2 | Semiconductor package including an image sensor chip and a method of fabricating the same | Electricity | 0 | Active |
| US10615213B2 | Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the same | Electricity | 0 | Active |
| US10636760B2 | Semiconductor packages | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.