Inventor · Cheonan-si, KR

Yonghoe Cho

12Patents
2h-index
16Co-inventors
43Inventor score

Filing activity: Jun 3, 2018 → Jan 9, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US10748953B2 Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the same Electricity 2 Active
US11862596B2 Semiconductor package Electricity 2 Active
US11552037B2 Semiconductor package Electricity 1 Active
US11869818B2 Chip-stacked semiconductor package and method of manufacturing same Electricity 0 Active
US11328966B2 Chip-stacked semiconductor package and method of manufacturing same Electricity 0 Active
US11335719B2 Semiconductor package including an image sensor chip and a method of fabricating the same Electricity 0 Active
US12431474B2 Semiconductor package Electricity 0 Active
US11244894B2 Semiconductor packages Electricity 0 Active
US11776941B2 Semiconductor package Electricity 0 Active
US11824076B2 Semiconductor package including an image sensor chip and a method of fabricating the same Electricity 0 Active
US10615213B2 Methods of forming redistribution lines and methods of manufacturing semiconductor devices using the same Electricity 0 Active
US10636760B2 Semiconductor packages Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.